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1N6626US thru 1N6631US VOIDLESS-HERMETICALLY-SEALED SURFACE MOUNT ULTRA FAST RECOVERY GLASS RECTIFIERS
SCOTTSDALE DIVISION
DESCRIPTION
This "Ultrafast Recovery" rectifier diode series is military qualified to MIL-PRF19500/590 and is ideal for high-reliability applications where a failure cannot be tolerated. These industry-recognized 2.0 to 4.0 Amp rated rectifiers for working peak reverse voltages from 200 to 1000 volts are hermetically sealed with voidlessglass construction using an internal "Category I" metallurgical bond. These devices are also available in axial-leaded packages for thru-hole mounting (see separate data sheet for 1N6626 thru 1N6631). Microsemi also offers numerous other rectifier products to meet higher and lower current ratings with various recovery time speed requirements including standard, fast and ultrafast device types in both through-hole and surface mount packages.
IMPORTANT: For the most current data, consult MICROSEMI's website: http://www.microsemi.com
APPEARANCE
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Package "E" or D-5B
FEATURES
* * * * * * * Surface mount series equivalent to the JEDEC registered 1N6626 to 1N6631 series Voidless hermetically sealed glass package Extremely robust construction Triple-layer passivation Internal "Category I" Metallurgical bonds JAN, JANTX, and JANTXV available per MIL-PRF19500/590 Further options for screening in accordance with MILPRF-19500 for JANS by using a "MSP" prefix, e.g. MSP6626US, MSP6629US, etc. Axial-leaded equivalents also available (see separate data sheet for 1N6626 thru 1N6631) * * * * * *
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APPLICATIONS / BENEFITS
Ultrafast recovery rectifier series 200 to 1000 V Military and other high-reliability applications Switching power supplies or other applications requiring extremely fast switching & low forward loss High forward surge current capability Low thermal resistance Controlled avalanche with peak reverse power capability Inherently radiation hard as described in Microsemi
MicroNote 050
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MAXIMUM RATINGS
* * * Junction Temperature: -65 C to +175 C Storage Temperature: -65oC to +175oC Peak Forward Surge Current @ 25oC: 75A (except 1N6631 which is 60A) Note: Test pulse = 8.3ms, half-sine wave. Average Rectified Forward Current (IO) at TEC = +110oC: 1N6626US thru 1N6628US 4.0A 1N6629US thru 1N6630US 3.0A 1N6631US 2.5A (Derate linearly at 1.5%/oC for TEC > +110oC) Average Rectified Forward Current (IO) at TA=25oC: 1N6626US thru 1N6628US 2.0A 1N6629US thru 1N6631US 1.4A (Derate linearly at 0.67%/ oC for TA>+25oC. This IO rating is typical for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where TJ(max) is not exceeded.) Thermal Resistance junction to endcap (RJEC): 10oC/W Capacitance at VR= 10 V: 40 pF Solder temperature: 260oC for 10 s (maximum)
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MECHANICAL AND PACKAGING
* * * * * * * CASE: Hermetically sealed voidless hard glass with Tungsten slugs TERMINATIONS: End caps are solid Silver (Ag) with Tin/Lead finish MARKING: Cathode band only POLARITY: Cathode indicated by band Tape & Reel option: Standard per EIA-481-B Weight: 539 mg See package dimensions and recommended pad layout on last page
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1N6626US - 1N6631US 6626US
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Copyright 2004 11-01-2004 REV A
Microsemi
Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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1N6626US thru 1N6631US VOIDLESS-HERMETICALLY-SEALED SURFACE MOUNT ULTRA FAST RECOVERY GLASS RECTIFIERS
SCOTTSDALE DIVISION
ELECTRICAL CHARACTERISTICS @ 25oC
TYPE NUMBER MINIMUM BREAKDOWN VOLTAGE VR IR = 50 A MAXIMUM FORWARD VOLTAGE VF @ IF WORKING PEAK REVERSE VOLTAGE VRWM MAXIMUM REVERSE CURRENT IR @ VRWM TA=25oC TA=150oC MAXIMUM REVERSE RECOVERY TIME (LOW CURRENT) trr Note 1 MAXIMUM REVERSE RECOVERY TIME (HIGH CURRENT) trr Note 2 PEAK RECOVERY CURRENT IRM (rec) IF = 2 A, 100 A/s Note 2 FORWARD RECOVERY VOLTAGE VFRM Max IF = 0.5 A tr = 12 ns
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1N6626US 1N6627US 1N6628US 1N6629US 1N6630US 1N6631US
V 220 440 660 880 990 1100
V@A 1.35V @ 1.2A 1.35V @ 1.2A 1.35V @ 1.2A 1.40V @ 1.0A 1.40V @ 1.0A 1.60V @ 1.0A
V@A 1.50V @ 4.0A 1.50V @ 4.0A 1.50V @ 4.0A 1.70V @ 3.0A 1.70V @ 3.0A 1.95V @ 2.0A
V 200 400 600 800 900 1000
A 2.0 2.0 2.0 2.0 2.0 4.0
A 500 500 500 500 500 600
ns 30 30 30 50 50 60
ns 45 45 45 60 60 80
A 3.5 3.5 3.5 4.2 4.2 5.0
V 8 8 8 12 12 20
NOTE 1: Low Current Reverse Recovery Time Test Conditions: IF=0.5A, IRM=1.0A, IR(REC) = 0.25A per MIL-STD-750, Method 4031, Condition B. NOTE 2: High Current Reverse Recovery Time Test Conditions: IF = 2 A, 100 A/s MIL-STD-750, Method 4031, Condition D. Symbol
VBR VRWM VF IR C trr
SYMBOLS & DEFINITIONS Definition
Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current. Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating temperature range. Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current. Maximum Reverse Current: The maximum reverse (leakage) current that will flow at the specified voltage and temperature. Capacitance: The capacitance in pF at a frequency of 1 MHz and specified voltage. Reverse Recovery Time: The time interval between the instant the current passes through zero when changing from the forward direction to the reverse direction and a specified recovery decay point after a peak reverse current is reached.
CHARTS AND GRAPHS
1N6626US - 1N6631US
FIGURE 1 Typical Forward Current vs Forward Voltage
Copyright 2004 11-01-2004 REV A
FIGURE 2 Typical Forward Current vs Forward Voltage
Microsemi
Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 2
1N6626US thru 1N6631US VOIDLESS-HERMETICALLY-SEALED SURFACE MOUNT ULTRA FAST RECOVERY GLASS RECTIFIERS
SCOTTSDALE DIVISION
WWW . Microsemi .C OM
FIGURE 3 Typical Reverse Current vs. Applied Reverse Voltage
FIGURE 4 Typical Reverse Current vs. Applied Reverse Voltage
10ms
1N6626US - 1N6631US 6626US
FIGURE 5 Forward Pulse Current vs. Pulse Duration
FIGURE 6 Reverse Pulse Power vs. Pulse Duration
Copyright 2004 11-01-2004 REV A
Microsemi
Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 3
1N6626US thru 1N6631US VOIDLESS-HERMETICALLY-SEALED SURFACE MOUNT ULTRA FAST RECOVERY GLASS RECTIFIERS
SCOTTSDALE DIVISION
PACKAGE DIMENSIONS AND PAD LAYOUT
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NOTE: This Package Outline has also previously been identified as "D-5B"
A INCHES MIN BL BD ECT S .205 .137 .019 .003 MAX .225 .142 .028 --MIN 5.21 3.48 0.48 0.08 mm MAX 5.72 3.61 0.711 --B C
PAD LAYOUT
INCHES 0.288 0.070 0.155 mm 7.32 1.78 3.94
Note: If mounting requires adhesive separate from the solder, an additional 0.080 inch diameter contact may be placed in the center between the pads as an optional spot for cement.
1N6626US - 1N6631US
Copyright 2004 11-01-2004 REV A
Microsemi
Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 4

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